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Brewer Science Commercializes Thermal Slide Debonder for Compound Semiconductor Thin-Wafer Handling

Announces first commercial placement of its Cee 1300CSX thermal slide debonder

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

Brewer Science announced the first commercial placement of its Cee 1300CSX thermal slide debonder. This debonder was purchased by an industry leader in the production of high-powered radio frequency (RF) components for use in wireless communications.

The Cee 1300CSX thermal debonder enables high-temperature slide-off debonding of thinned silicon and compound semiconductor substrates (including GaAs, GaN, InP, and SiC) from a rigid carrier to allow further processing of delicate thinned wafers. This debonding can be accomplished in a confidential laboratory setting without interrupting high-volume track production time and without investing large amounts of capital in additional automation.

“This commercial launch marks another strategic milestone in reducing the customer’s cost of ownership for thin-wafer handling through Brewer Science’s industry-leading equipment, temporary bonding materials, and process integration,” said Justin Furse, Brewer Science equipment technology strategist.

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